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DISCRETE SEMICONDUCTORS
DATA SHEET
KMI15/1 Integrated rotational speed sensor
Preliminary specification File under Discrete Semiconductors, SC17 1996 Dec 05
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
FEATURES * Digital current output signal * Zero speed capability * Wide air gap * Wide temperature range * Insensitive to vibration * EMC resistant.
handbook, halfpage
KMI15/1
PINNING PIN 1 2 VCC V- DESCRIPTION
DESCRIPTION The KMI15/1 sensor detects rotational speed of ferrous gear wheels and reference marks(1). The sensor consists of a magnetoresistive sensor element, a signal conditioning integrated circuit in bipolar technology and a magnetized ferrite magnet. The frequency of the digital current output signal is proportional to the rotational speed of a gear wheel. CAUTION Do not press two or more products together against their magnetic forces.
(1) The sensor contains a customized integrated circuit. Usage in hydraulic brake systems and in systems with active brake control is forbidden.
1 2
MBH781
Fig.1 Simplified outline; (SOT453B).
QUICK REFERENCE DATA SYMBOL VCC ICC (low) ICC (high) d ft Tamb PARAMETER DC supply voltage current output signal low current output signal high sensing distance operating tooth frequency ambient operating temperature - - - 0 to 2.5 0 -40 MIN. 12 7 14 0 to 2.9 - - TYP. - - - - 25000 +85 MAX. V mA mA mm Hz C UNIT
1996 Dec 05
2
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
LIMITING VALUES In accordance with Absolute Maximum Rating System (IEC 134). SYMBOL VCC Tstg Tamb Tsld PARAMETER DC supply voltage storage temperature ambient operating temperature soldering temperature output short-circuit duration to GND Note t 10 s CONDITIONS Tamb = -40 to +85 C; RL = 115 - -40 -40 - MIN.
KMI15/1
MAX. 16 +150 +85 260 V
UNIT C C C
continuous; note 1
1. With RL = 115 the device is continuously protected against wrong polarity of DC supply voltage (VCC) to GND (see Fig.7). CHARACTERISTICS Tamb = 25 C; VCC = 12 V; d = 2.1 mm; ft = 2 kHz; test circuit: see Fig.7; RL = 115 ; sensor positioning: see Fig.15; gear wheel: module 2 mm; material 1.0715; unless otherwise specified. SYMBOL ICC (low) ICC (high) tr tf td ft d Note 1. High rotational speeds of wheels reduce the sensing distance due to eddy current effects (see Fig.17). PARAMETER current output signal low current output signal high output signal rise time output signal fall time switching delay time CONDITIONS see Figs 6 and 8 see Figs 6 and 8 MIN. 5.6 11.2 TYP. 7.0 14.0 0.5 0.7 1 - 50 MAX. 8.4 16.8 - - - 25000 70 UNIT mA mA s s s Hz mm %
CL = 100 pF; see Fig.9; 10 to 90% value - CL = 100 pF; see Fig.9; 10 to 90% value - between stimulation pulse (generated by a coil) and output signal see Fig.15 and note 1 see Fig.6 - 0 30
operating tooth frequency for both rotation directions sensing distance duty cycle
0 to 2.5 0 to 2.9 -
1996 Dec 05
3
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
FUNCTIONAL DESCRIPTION The KMI15/1 sensor is sensitive to the motion of ferrous gear wheels or reference marks. The functional principle is shown in Fig.3. Due to the effect of flux bending, the different directions of magnetic field lines in the magnetoresistive sensor element will cause an electrical signal. Because of the chosen sensor orientation and the direction of ferrite magnetization, the KMI15/1 is sensitive to movement in the `y' direction in front of the sensor only (see Fig.2). The magnetoresistive sensor element signal is amplified, temperature compensated and passed to a Schmitt trigger in the conditioning integrated circuit (Figs 4 and 5). The digital output signal level (see Fig.6) is independent of the sensing distance within the measuring range (Fig.14). A (2-wire) output current enables safe transfer of the sensor signal to the detecting circuit (see Fig.7). The integrated circuit housing is separated from the sensor element housing to optimize the sensor behaviour at high temperatures.
handbook, halfpage
KMI15/1
x magnet with direction of magnetization
x z
y
sensor
IC
MBH778
Fig.2 Component detail of the KMI15/1.
gear handbook, full pagewidth wheel z magnet magnetic field lines direction of motion
sensor
y
MRA957
(a)
(b)
(c)
(d)
Fig.3 Functional principle.
1996 Dec 05
4
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
KMI15/1
handbook, full pagewidth
VOLTAGE CONTROL
CONSTANT CURRENT SOURCE
V CC
SENSOR
AMPLIFIER
SCHMITT TRIGGER
SWITCHABLE CURRENT SOURCE
V
MRA958
Fig.4 Block diagram.
handbook, full pagewidth
VCC switchable current source constant current source
sensor
power supply
EMC FILTER preamplifier Schmitttrigger
Vref GAP
V
MRA959
Fig.5 Simplified circuit diagram.
1996 Dec 05
5
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
KMI15/1
handbook, halfpage
MRA960
I CC T 14 mA SENSOR V I CC 7 mA tp
MRA961
V CC
RL
CL GND
t
tp = --- x 100% T
Fig.6 Output signal as a function of time.
Fig.7 Test and application circuit.
APPLICATION INFORMATION
handbook, halfpage I
16 CC (mA) 14
MRA967
handbook, halfpage
1
MRA968
VCC = 20 V
t ( s)
VCC = 12 V VCC = 8 V
0.8
tf
I CC(high) 12
0.6 tr
10
0.4 VCC = 20 V I CC(low) ICC VCC = 12 V VCC = 8 V 0 50 0 50 0.2 tr 100 tf t 150 200 Tamb ( oC)
8
6
4
50
0
50
100
150
200
Tamb (oC)
VCC = 12 V; CL = 100 pF; RL = 115 .
Fig.8
Output current levels as functions of ambient temperature.
Fig.9
Output current switching times as functions of ambient temperature.
1996 Dec 05
6
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
Mounting conditions The recommended sensor position in front of a gear wheel is shown in Fig.15. The distance `d' is measured between the sensor front and the tip of a gear wheel tooth. The KMI15/1 senses ferrous indicators like gear wheels in the y direction only (no rotational symmetry of the sensor); see Fig.2. The effect of incorrect mounting positions on sensing distance is shown in Figs 11, 12 and 13. The symmetrical reference axis of the sensor corresponds to the axis of the ferrite magnet. Environmental conditions Due to eddy current effects the sensing distance depends on the tooth frequency (Fig.17). The influence of gear wheel module on the sensing distance is shown in Fig.16. Gear Wheel Dimensions SYMBOL German DIN z d m p ASA; note1 PD DP CP Note pitch diameter (d in inch) diametric pitch DP = z/PD circular pitch CP = /DP number of teeth diameter module m = d/z pitch p = x m DESCRIPTION
KMI15/1
UNIT
mm mm mm
inch inch-1 inch
1. For conversion from ASA to DIN: m = 25.4 mm/DP; p = 25.4 mm x CP.
handbook, halfpage
4
MRA998
d (mm)
pitch
handbook, halfpage
3
2 y pitch diameter
MRA964
d 1
0 0
1
2
3 y (mm)
4
pitch diameter module = ----------------------------------------number of teeth pitch = module x
VCC = 12 V; ft = 2 kHz; module = 2 mm; pitch diameter = 100 mm.
Fig.10 Gear wheel dimensions.
Fig.11 Sensing distance as a function of positional tolerance in the y-axis.
1996 Dec 05
7
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
KMI15/1
handbook, halfpage
4
MRA999
handbook, halfpage
4
MRA982
d (mm)
d (mm) 3
3
2 d 1
2 d
x
1
0 0
10 mm
1 2 3 (deg) 4
0
-6
-4
-2
0
2
4
6 x (mm)
VCC = 12 V; ft = 2 kHz; module = 2 mm.
VCC = 12 V; ft = 2 kHz; module = 2 mm.
Fig.12 Sensing distance as a function of positional tolerance.
Fig.13 Sensing distance as a function of positional tolerance in the x-axis.
handbook, halfpage
4
MRA962
d (mm)
handbook, halfpage
sensor d
3
d
2 d 1
MRA963
gear wheel
0 -50
0
50
100
150 200 Tamb (oC)
VCC = 12 V; ft = 2 kHz; module = 2 mm.
Fig.14 Sensing distance as a function of ambient temperature.
Fig.15 Sensor positioning.
1996 Dec 05
8
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
KMI15/1
handbook, halfpage
1.5
MRA966
handbook, halfpage
4
MRA965
d d0
d (mm)
3
1
2 d tooth frequency ft 1
0.5
0
0
1
2
3
4 5 module m (mm)
0 0
1
2
3 f (kHz)
4
do = measuring distance for a gear wheel with module m = 2 mm.
VCC = 12 V; module = 2 mm.
Fig.16 Normalized maximum sensing distance as a function of gear wheel module.
Fig.17 Sensing distance as a function of tooth frequency.
1996 Dec 05
9
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
EMC Figure 18 shows a recommended application circuit for automotive applications (wheel sensing ft < 5 kHz). It provides a protection interface to meet Electromagnetic Compatibility (EMC) standards and safeguard against voltage spikes. Table 1 lists the tests which are applicable to this circuit and the achieved class of functional status. Protection against `load dump' (test pulse 5 according to "DIN 40839") means a very high demand on the protection circuit and requires a suitable suppressor diode with sufficient energy absorption capability. Table 1 EMC test results SYMBOL VLD VLD VLD VLD VLD VLD - -150 - -7 - MIN. (V) -100 - 100 - 100 - 120 MAX. (V) REMARKS td = 2 ms td = 0.2 ms td = 0.1 s td = 0.1 s td = 130 ms td = 400 ms C A A A B B
KMI15/1
The board net often contains a central load dump protection that makes such a device in the protection circuit of the sensor module unnecessary. Tests for electrostatic discharge (ESD) were conducted in line with "IEC 801-2" to demonstrate the KMI15/1's handling capabilities. The "IEC 801-2" test conditions were: C = 150 pF, R = 150 , V = 2 kV. Electromagnetic disturbances with fields up to 150 V/m and f = 1 GHz (ref. "DIN 40839") have no influence on performance.
EMC REF. DIN 40839 Test pulse 1 Test pulse 2 Test pulse 3a Test pulse 3b Test pulse 4 Test pulse 5
CLASS
handbook, halfpage
D1
+V
VCC 1N4001/3 BZTO3G36 D2 C1 100 nF RL 115 CL 100 nF -V
SENSOR
GND
MGD805
Fig.18 Test/application circuit for the KMI15/1.
1996 Dec 05
10
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
PACKAGE OUTLINE Package description
KMI15/1
SOT453B
M1 HE1 E B
vMAB K A Q
A L1 M2 bp1 D
L
E1
vMAB
M3
HE D1
L2 (+) bp e scale (-) c 0 2.5 5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.7 1.4 bp 0.8 0.7 bp1 1.5 1.4 c 0.3 0.24 D(1) 4.1 3.9 D1(1) 5.7 5.5 E(1) 4.5 4.3 E1(1) 5.7 5.5 e 4.6 4.4 HE 18.2 17.8 HE1 5.6 5.5 K max. 5.37 L 7.55 7.25 L1 1.2 0.9 L2 3.9 3.5 M1 8.15 7.85 M2 8.15 7.85 M3 4.7 4.3 Q 0.75 0.65 v 0.25
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT453B REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 96-11-12
1996 Dec 05
11
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
KMI15/1
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1996 Dec 05
12
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
NOTES
KMI15/1
1996 Dec 05
13
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
NOTES
KMI15/1
1996 Dec 05
14
Philips Semiconductors
Preliminary specification
Integrated rotational speed sensor
NOTES
KMI15/1
1996 Dec 05
15
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1996
Internet: http://www.semiconductors.philips.com
SCA52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
147021/1200/01/pp16
Date of release: 1996 Dec 05
Document order number:
9397 750 01315

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